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Kinco to attend PACK EXPO International 2014 in Chicago
2014/9/10 15:11:38   Source:   Hits:

 

Kinco will participate in Pack Expo International 2014, here to invite you to join in this exhibition and visit our booth LKS 8644. PACK EXPO International will take place November 2-5, 2014 in Chicago, IL, at McCormick Place.

 
PACK EXPO International is the event that defines the latest innovations and trends in the processing and packaging industry, and Kinco will bring HMI, PLC, Servo System, Stepper System and VFD for USA market.
 
You can make your appointment with Mr. Mark Luo at luojie@kinco.cn.
 
Exhibition        PACK EXPO International 2014
Date                 2 - 5th Nov. 2014
Place             IL, Chicago
Kinco Booth    LKS 8644